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Company Introduction
Role Overview
You will lead the architectural vision for our next-generation data centers, transitioning our global footprint from traditional colocation models to high-density AI Factories. You are responsible for the physical and logical blueprint of the facility—ensuring that our "white space" can support 100kW+ racks, liquid-to-chip cooling, and the massive throughput requirements of 800G/1.6T networking.
Responsibilities
- Facility Strategy: Design the "Basis of Design" (BOD) for hyperscale facilities, including site selection, building massing, and modular "pod" scalability.
- Thermal Management: Architect the transition from air-cooled data halls to Hybrid Cooling environments (Direct-to-Chip, Rear Door Heat Exchangers, and Immersion Cooling) to support high-TDP AI chips.
- Power Energy: Partner with electrical engineers to design high-availability power chains (N+1/2N) capable of supporting 50MW+ of IT load per hall. Evaluate the integration of Small Modular Reactors (SMRs) or hydrogen fuel cells for onsite power.
- Network Fabric Topology: Define the physical layout for OSFP-based high-radix fabrics. Optimize cabling pathways and "meet-me-room" designs to minimize signal degradation for InfiniBand and RoCE v2 compute planes.
- Modular Construction: Drive the adoption of modular "skid-based" deployments to accelerate construction timelines by 30% without sacrificing reliability or efficiency (PUE).
- Sustainability ESG: Ensure designs meet 2026 carbon-neutrality standards by implementing waste-heat reuse for local district heating and optimizing Water Usage Effectiveness (WUE).
Qualifications
- Education
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B.Tech/M.S. or Ph.D. in Computer Science, Electrical Engineering, or a related field (or equivalent industrial experience)
- Required Technical Expertise
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Physical Infrastructure: Deep understanding of rack densities (moving from 15kW to 100kW+), busways, and floor loading for heavy liquid-cooled systems
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Hardware Lifecycle: Mastery of the latest server form factors, including E1.S/E3.S storage and the mechanical requirements of NVIDIA Blackwell/Rubin rack systems
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Networking Standards: Expert knowledge of the physical layer (OSFP/QSFP-DD), fiber types (OM5/Single-mode), and OSPF/BGP routing at the facility scale
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BIM Digital Twin: Proficiency in Revit, AutoCAD, and Digital Twin platforms to simulate airflow, power distribution, and maintenance accessibility before breaking ground
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Preferred Qualifications
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10+ years in mission-critical facility design or lead architectural roles at a Hyperscaler (AWS, Google, Meta) or Tier-1 Provider (Equinix, Digital Realty)
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Expertise in Uptime Institute Tier Standards and LEED Platinum certifications
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Experience with "AI-driven DCIM" (Data Center Infrastructure Management) tools for predictive maintenance
- Domain Skills Needed
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Cooling: Direct-to-Chip (DLC), CDU Integration, Water-Side Economizers
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Compute: GPU Cluster Architecture, DPU Integration (BlueField)
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Network: 800G/1.6T OSFP Optics, Fiber Density, OSPF Routing
- Storage: NVMe-over-Fabrics (NVMe-oF), E1.S EDSFF
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Construction: Modular Design, Prefabricated Power Skids, BIM
Recruitment Process and Others
- Recruitment Process
- Application Review - Job Fit Interview - Focus Interview - Offer
- Things to Consider
- This job posting may be closed prior to the stated end date for application if all openings are filled.
- Privacy Notice
- Your personal information will be collected and managed by Coupang as stated in the Application Privacy Notice located HERE .
- Document Return Policy
- This notification is given pursuant to Article 11 (6) of the Fair Hiring Procedure Act.
- A job appli
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