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귀하가 주도했던 Hyperscale 시설의 'Basis of Design(BOD)' 수립 과정에서, 기존 Colocation 모델 대비 고밀도 AI Factory를 위한 공간 효율성 및 모듈화 전략을 어떻게 설계했으며, 그 결과 PUE(Power Usage Effectiveness)는 얼마로 달성했습니까?

🎯 거시적인 시설 전략 수립 능력과 실제 성과(PUE)를 확인

고밀도 AI 칩(예: Blackwell) 환경에서 100kW+ 랙을 수용하기 위해 액체 냉각(Liquid-to-Chip, Immersion) 시스템을 도입할 때, 냉각 시스템의 설계와 전력 공급 체인(Power Chain)을 엔지니어링 팀과 어떻게 협업하여 최적화했으며, 예상치 못한 열 부하 변동에 어떻게 대응했는지 구체적인 사례를 들어 설명해 주십시오.

🎯 핵심 기술(냉각, 전력)의 통합 설계 능력과 실제 엔지니어링 협업 경험을 확인

800G/1.6T 네트워크 패브릭(OSFP 기반)을 물리적으로 배치하고 InfiniBand/RoCE v2 통신 지연을 최소화하기 위한 물리적 레이아웃(Physical Layout)을 어떻게 정의했습니까? 특히, 광섬유 경로와 Meet-me-room 설계를 통해 신호 감쇠를 어떻게 관리했는지 숫자를 들어 설명해 주십시오.

🎯 네트워크 인프라의 물리적 레이아웃 설계 및 성능 최적화 능력을 확인

시설 구축 시 건설 기간을 30% 단축하기 위해 모듈식(Skid-based) 배포를 추진할 때, 기존의 신뢰성(Uptime Tier Standard)을 유지하면서 모듈 통합의 위험을 어떻게 관리했습니까? 만약 모듈 설치 중 예상치 못한 물리적 제약이 발생했다면, 어떤 의사결정 과정을 거쳐 공정 지연을 최소화했는지 설명해 주십시오.

🎯 모듈화 전략의 실행 능력과 위험 관리(Risk Management) 및 의사결정 과정을 확인

귀하가 경험했던 대규모 데이터센터 인프라 구축 프로젝트에서, AI-driven DCIM 도구를 활용하여 예측 유지보수(Predictive Maintenance)를 구현했을 때, 실제로 운영 비용(OpEx) 또는 다운타임 감소에 어떤 정량적인 기여를 했는지 구체적인 데이터와 협업 사례를 제시해 주십시오.

🎯 최신 기술(AI-DCIM) 적용 경험과 비즈니스 성과(비용 절감, 효율 증대)를 확인

질문만 읽으면 컨닝이에요. 소리 내어 답해보세요 — 어디서 틀어지는지 짚어드립니다.

공고 내용

Company Introduction

We exist to wow our customers. We know we're doing the right thing when we hear our customers say, "How did we ever live without Coupang?" Born out of an obsession to make shopping, eating, and living easier than ever, we're collectively disrupting the multi-billion-dollar e-commerce industry from the ground up. We are one of the fastest-growing e-commerce companies that established an unparalleled reputation for being a dominant and reliable force in South Korean commerce.

Our mission to build the future of commerce is real. We push the boundaries of what's possible to solve problems and break traditional tradeoffs. Join Coupang now to create an epic experience in this always-on, high-tech, and hyper-connected world.

Role Overview

You will lead the architectural vision for our next-generation data centers, transitioning our global footprint from traditional colocation models to high-density AI Factories. You are responsible for the physical and logical blueprint of the facility—ensuring that our "white space" can support 100kW+ racks, liquid-to-chip cooling, and the massive throughput requirements of 800G/1.6T networking.

Responsibilities

· Facility Strategy: Design the "Basis of Design" (BOD) for hyperscale facilities, including site selection, building massing, and modular "pod" scalability.

· Thermal Management: Architect the transition from air-cooled data halls to Hybrid Cooling environments (Direct-to-Chip, Rear Door Heat Exchangers, and Immersion Cooling) to support high-TDP AI chips.

· Power Energy: Partner with electrical engineers to design high-availability power chains (N+1/2N) capable of supporting 50MW+ of IT load per hall. Evaluate the integration of Small Modular Reactors (SMRs) or hydrogen fuel cells for onsite power.

· Network Fabric Topology: Define the physical layout for OSFP-based high-radix fabrics. Optimize cabling pathways and "meet-me-room" designs to minimize signal degradation for InfiniBand and RoCE v2 compute planes.

· Modular Construction: Drive the adoption of modular "skid-based" deployments to accelerate construction timelines by 30% without sacrificing reliability or efficiency (PUE).

· Sustainability ESG: Ensure designs meet 2026 carbon-neutrality standards by implementing waste-heat reuse for local district heating and optimizing Water Usage Effectiveness (WUE).

Qualifications

· Education

B.Tech/M.S. or Ph.D. in Computer Science, Electrical Engineering, or a related field (or equivalent industrial experience)

· Required Technical Expertise

Physical Infrastructure: Deep understanding of rack densities (moving from 15kW to 100kW+), busways, and floor loading for heavy liquid-cooled systems

Hardware Lifecycle: Mastery of the latest server form factors, including E1.S/E3.S storage and the mechanical requirements of NVIDIA Blackwell/Rubin rack systems

Networking Standards: Expert knowledge of the physical layer (OSFP/QSFP-DD), fiber types (OM5/Single-mode), and OSPF/BGP routing at the facility scale

BIM Digital Twin: Proficiency in Revit, AutoCAD, and Digital Twin platforms to simulate airflow, power distribution, and maintenance accessibility before breaking ground

Preferred Qualifications

10+ years in mission-critical facility design or lead architectural roles at a Hyperscaler (AWS, Google, Meta) or Tier-1 Provider (Equinix, Digital Realty)

Expertise in Uptime Institute Tier Standards and LEED Platinum certifications

Experience with "AI-driven DCIM" (Data Center Infrastructure Management) tools for predictive maintenance

· Domain Skills Needed

Cooling: Direct-to-Chip (DLC), CDU Integration, Water-Side Economizers

Compute: GPU Cluster Architecture, DPU Integration (BlueField)

Network: 800G/1.6T OSFP Optics, Fiber Density, OSPF Routing

· Storage: NVMe-over-Fabrics (NVMe-oF), E1.S EDSFF

Construction: Modular Design, Prefabricated Power Skids, BIM

Recruitment Process and Others

· Recruitment Process

· Application Review - Phone Interview - Onsite (or Virtual Onsite) Interview – Offer

· The exact nature of the recruitment process may vary according to the specific job and may be changed due to scheduling or other circumstances.

· Interview schedules and the results will be informed to the applicant via the e-mail address submitted at the application stage.

· Things to Consider

· This job posting may be closed prior to the stated end date for application if all openings are filled.

· Coupang has the right to rescind an offer of employment if a candidate is found to have submitted false information as part of the application process.

· Coupang does not discriminate against disabled applicants or those with veteran status. We are proud to offer equal opportunities for all applicants.

· Privacy Notice

· Your personal information will be collected and managed by Coupang as stated in the Application Privacy Notice located HERE .

· Document Return Policy

· This notification is given pursuant to Article 11 (6) of the Fair Hiring Procedure

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